Power Integrity and Electromagnetic Interface and Analysis

CADSTAR Power Integrity Advance

CADSTAR Power Integrity Advance provides fast and practical power integrity and electromagnetic interference analysis within the CADSTAR PCB design flow, offering EMI, AC and DC power analysis to help you determine the best decoupling and power distribution strategy for your layout.

Designs that utilize numerous complex high pin-count ICs such as FPGAs, DSPs and CPUs operate on multiple voltage rails, requiring careful planning of the power distribution system to minimize parasitic noise and fast switching currents that can negatively impact system performance and EMC behavior.

Power Integrity Advance provides full board EMC screening for both differential and common mode board level EMC, allowing the Layout Specialist to identify potential electromagnetic emission hotspots at an early stage and resolve them by revising component placement, routing, layer assignment and power distribution strategies.

DC Analysis creates an equivalent DC circuit of your PCB that includes model information to verify DC voltage drop and current flow, helping to identify design features such as plane splits or areas of high via density that may cause voltage drop at the target device.

AC Analysis verifies plane impedance characteristics to assist the design engineer in the planning and selection of the decoupling capacitor network, helping to optimize board real estate and determine the correct distribution of decoupling capacitor values.

Features and Benefits
  • Ensure quality and integrity of the power distribution system during and after layout
  • Provide full board EMC screening for differential and common mode board level EMC effects prior to production of the first prototype
  • Accurate modeling of copper shapes for power delivery and noise transmission
  • Simulate power distribution impedance profile over frequency and crosstalk hotspots for common mode noise
  • Save cost and board space by reducing the number of decoupling capacitors
  • Improve decoupling by determining correct distribution of capacitor values
  • Indicate quality of placement location, value and trace/via connection
  • Provide a clear graphical display of voltage and current distribution map for voltage drops and excessive current density
Resources
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Tews Significantly Reduces Development Time and Cost of Complex High-speed PCBs using Concurrent Power Integrity Simulation

TEWS Technologies encountered challenges around power distribution on PCBs for their embedded interface modules, due to today’s increasingly complex designs.

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Datasheet: CADSTAR Power Integrity Advance

CADSTAR Power Integrity Advance provides fast and practical power integrity and electromagnetic interference analysis within the real-time PCB design flow.

Download
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Electronic Specifier: Power Integrity Module is a Star Turn

TEWS reduced development time and cost of complex high-speed PCBs using concurrent power integrity simulation. Michael Költzow, TEWS Technologies explains how it was done.

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Signal Integrity & Power Integrity Movies for CADSTAR

Are you looking to increase the capabilities and complexity of your PCBs designed within CADSTAR? Maybe you’ve got pressure to deliver more functionality from others within the product development team, but are unsure how to deal with the resulting signal integrity and power integrity issues?

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CADSTAR Users Enthusiastic about New Power Integrity Advance Solution

Current design practice involves spreading decoupling capacitors over the boards to prevent power distribution issues during the engineering of printed circuit boards. But this may cause an over-defensive design, unnecessary costs, and sometimes problems that are only detected in the first prototype. Much tighter requirements due to regulations, quality, and time-to-market, mean that these time-consuming tasks need to be shifted into the design flow.

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    Signal Integrity Verify
    TEWS Technologies: Concurrent Power Integrity Case Study
    “Even though we did not expect to match chamber measurement with accurate dBs, the ease-of-use and reliability of the results of Power-Integrity Advance EMI, together with its fast analysis, gave us important hints about radiation hot spots on the board well before we produced the first prototype.”
    – Michael Költzow, Senior CAD Engineer, TEWS Technologies

    Read Success Story

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    Datasheet: CADSTAR Power Integrity Advance

    CADSTAR Power Integrity Advance provides fast and practical power integrity and electromagnetic interference analysis within the real-time PCB design flow.

    Download