3D Multi-board PCB Design

Design Force

The highest performing board design and analysis solution, Design Force supports single board, multi-board and chip-package-board interconnect analysis and optimization. Combining traditional 2D design with native 3D design and the latest human interface techniques, accelerated graphics and almost instantaneous rendering and refreshing, Design Force is the fastest, most effective PCB design solution available today.

A mouse in one hand and a touchpad in the other enables two-handed design. Menu picks, mouse clicks and mouse travel distance are greatly reduced, making it much faster and easier to use than comparable ECAD solutions.

Design Force enables design teams to layout their designs as in the context of a complete system or product. Designers can easily create any design from quick prototype boards to complex, multi-board systems using one tool.

Panasonic logo“In the development of the world’s thinnest and lightest 20-inch large-screen 4K tablet, CR-8000 Design Force’s system-level SI and thermal analysis effectively reduced the number of design spins during the project. Due to the success of this project, we will make more efforts with Zuken to develop our next generation 4K tablet using CR-8000 Design Force.”
– Mr. Kiyoshi Nakanishi, 4K Tablet Development Manager

3D PCB Design Multi-board Design Basics – Don’t Fall Behind

PCB Design software
Ease of Use

With inherent support for high-speed designs, engineers and layout designers can conduct signal integrity, EMC, and power integrity analysis concurrently, manage constraints, and autoroute a board – all in one environment. With a native 2D and 3D architecture, designers can effectively co-design a chip, package and board to optimize I/Os at each level, embed components in the dielectric of a stack-up intelligently, and verify manufacturing rules in real-time. Produce designs with concurrent design-for-manufacturing checks and constraint verification to ensure both manufacturing and engineering intent are maintained during the design process.

It includes interactive and automatic design tools with embedded SI analysis and verification.

Advanced Packaging

As IC packaging architecture advances, Zuken’s Design Force enables the designer to deal with the growing complexity in design space in handling high pin-counts, high density designs and the need to interface with multiple formats and flows. Parametric wizards are available to define and optimize pin maps. A native 3D interface is available to deal with the various package architectures allowing for seamless co-design with chip and PCB designs. For feasibility studies, automatic fan-out and full routing features are available.

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Advanced IC Packaging
Chip-Package-Board Co-design

Zuken’s CR-8000 Design Force offers true co-design through a hierarchical setup wherein multiple designs can be brought together in the same framework. The connectivity between designs can be setup automatically or manually. The user is then able to move between designs (chip RDL, package or board or any combination thereof). This enables user to accurately see and edit the nets/routing on a system scale.

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Chip Package Board Co-design
Simulation and Analysis

CR-8000 is a complete design environment that includes fully integrated simulation and analysis tools to verify your single or multi-board designs. During circuit design, Design Gateway provides embedded simulation, analysis and electrical rules checking. During PCB layout, the Design Force embedded signal integrity, power integrity, electromagnetic interference, and electromagnetic compatibility tools provide a single environment solution for all of your design team’s simulation and analysis requirements. This eliminates the need for time-intensive export, analyze, rework and repeat using separate tools. Simulation and analysis can be performed on a single board (SI/PI/EMI/EMC) or across multiple boards (SI). Identify and correct system and board-level errors and issues early in the design process!

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Simulation and Analysis
ECAD/MCAD Convergence

3D product visualization is becoming a critical need as the electrical and mechanical designs converge with little room for error. Many companies cite ECAD / MCAD design synchronization as a significant product design challenge. Traditional 2D PCB-centric design cannot meet the needs of a 3D multi-discipline product design process.

Design Force has the ability to import and export STEP models so MCAD design data exchange is direct and without data conversion. True 3D component models and enclosures can be obtained from any number of MCAD design tools. Once imported into Design Force, the PCB or multiple PCBs can be oriented within the enclosure and checked for a required clearance or an actual collision. Using accurate 3D checks with a true 3D component model with a precisely-matched 3D shape, rather than simplified boundary boxes, increases the overall accuracy of collision checking and reduces the risk of prototype reworking at the manufacturing stage because of a fit problem.

The ability to quickly and repeatedly verify fit during the design process will eliminate costly downstream ECAD / MCAD integration problems.

3D ECAD/MCAD Convergence
Dragon EX

Multi-Instance, Interactive and Automatic Routing

Dragon EX for Design Force empowers designers with simultaneous access to Zuken’s advanced interactive and automatic routing capabilities. During board layout, users specify multiple instances of strategy-driven areas and simultaneously autoroute the design. This significantly improves design completion times.

Users specify a routing strategy within each area defined with Dragon EX. Using Routing Consultant, they can analyze potential obstacles impacting the router and automatically create strategies based on objects and rules defined in the design. Dragon EX creates fanouts or escape routing patterns to simplify implementation and improve the routability of high pin-count devices.

Dragon Ex
Resources
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Webinar: Electro-Magnetic Compatibility (EMC) Design Basics

In this webinar we will explore the process for performing a quick EMC analysis followed by a more in-depth EMC analysis driven by properties assigned during schematic capture.

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Webinar: 3D Multi-board Design Basics - Don't Fall Behind

This webinar will discuss and demonstrate the key concepts behind a 3D multi-discipline design where supplychain, PCB, MCAD and analysis all converge into a next generation design process.

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Webinar: Protect Your ECAD Library and PCB Design Intellectual Property

This webinar will demonstrate how next generation ECAD software is being used to address the IP theft challenge with permission controls that enable users to define with a high level of granularity the design information that will be included and excluded from the published data set.

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Webinar: I/O Optimization with 3D SoC, SiP, and PCB Co-design

This webinar is aimed to help the audience identify disconnects in the chip, package, and board design environment; and explore methods to optimize interconnects, improve design collaboration, and enable signal traceability and analysis across the complete system.

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White Paper: 3D Convergence of Multi-board PCB and IC Packaging Design

The electronic product design process is being challenged like never before, with the need to develop feature-rich, light, compact products at a lower cost in less time.

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White Paper: Design Products, Not Just Boards - The Shift to Product-centric Design

This white paper explores the benefits of product-centric design and how it differs from current-generation PCB-centric processes and tools.

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Case Study: Endress+Hauser standardizes PCB engineering and production processes for industrial measurement products across distributed locations

Endress+Hauser is a global leader in measurement instrumentation, services and solutions for industrial process engineering.

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Case Study: Renishaw gets better fit and impedance control for complex flexible PCBs in metrology instruments using CR-8000

Working in 3D for the first time, Renishaw’s PCB designers noticed a host of benefits, including fixing housing fit issues upfront and easier component placement.

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Case Study: Rohde & Schwarz manages variants with increased efficiency using Zuken’s CR-5000 suite

Rohde & Schwarz manages variants with increased efficiency using Zuken’s CR-5000 suite. In a sophisticated design flow, the schematic provides a master data set that drives all PCB assembly variants.

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Design Force - Multi-board System Design

Design Force fully leverages the latest industry hardware and software capabilities, allowing users to design in a native 3D environment, obtaining optimal performance by utilizing native 64-bit, multi-threading, multi-core processors.

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Datasheet: Design Force - Chip, Package and Board Co-Design

Comprehensive system co-design recognizes the interaction between chip, package, and board data to reduce complexity, size and cost of the overall system.

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Datasheet: Design Force - Advanced Packaging

Traditional two dimensional design tools often fall short when it comes to studyingthe structure and routability of the advanced packages required for today’scomplex designs.

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