ANSYS Innovation Conference – Southern California

When:
May 30, 2019 @ 12:00 pm – 8:00 pm America/Detroit Timezone
2019-05-30T12:00:00-04:00
2019-05-30T20:00:00-04:00
Where:
UC Irvine Applied Innovation
5141 California Avenue Suite 250 Irvine
CA 92617
Cost:
Free
Contact:

Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.

Join us in Irvine, CA for the annual ANSYS Innovation Conference on May 30, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.

This event is FREE to attend, register early to reserve your spot. Lunch will be provided.  Complimentary parking is available.

Presentations:

Title: “Package Development of Large Scale SoCs Using CR-8000 Design Force and Ansys”

Speaker: Motochika Okano, Chief Specialist, Package Solution Technology Development Dept., Toshiba

Summary: Traditional design processes constrain the ability to conduct feasibility studies on identifying optimal package architectures from a system-level perspective. Feedback from these studies is manually communicated for production design, leading to an inefficient process and creates difficulty in correlating analysis data. This presentation will explain how collaboration with Ansys and Zuken enables new design and analysis flow that streamlines the feasibility phase and driving the intelligent process to production design to help release an implementation of current and future package architectures.

 

Title: “Enabling Early and Fast Thermal Simulation for 3D Multi-Die System Designs”

Speaker: Lance Wang

Summary: As design complexity increases with 3DICs  and time-to-market becomes a critical component in the automotive, wearables and IoT segments, reducing design cycle time while maintaining the accuracy of analysis has become all the more important. To address this, a system level co-design approach in step with multi-physics analysis is presented. To mitigate errors due to the manual exchange of data between various engineering teams spread across chip, package, and board with design and analysis adding a further level of exchange, a design flow incorporating simplification at the layout level is shown. The flow enables various levels of simplified models to be used, wherein data transfer between the complex 3D structures in layout to the thermal analysis tool is automated. The efficacy of the model simplification is verified through a test case showing comparable results for the simplified and full models.

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