IMAPS 2019

October 1, 2019 – October 3, 2019 all-day America/Detroit Timezone
Sheraton Boston
39 Dalton St
Boston, MA 02199

Title: System I/O Optimization with SoC, SiP, PCB Co-Design

Presenter: Lance Wang

Abstract: The increasing complexity of system on chips (SoCs) combined with a new generation of designs that combine multiple chips in a single package is creating new challenges in the design of packages, printed circuit boards (PCBs) and integrated circuits (ICs). The process typically involves three independent design processes – chip, package, and PCB – carried out with point tools whose interface requires time-consuming manual processes that are error-prone and limit the potential for reuse. This challenge is being addressed by a new integrated 3D chip/package/board co-design environment that makes it possible to holistically optimize the package, board and IC design to a greater degree than was possible in the past by considering the system-level impact of each design decision. The new co-design approach enables designers to optimize routability via pin assignment and I/O placement to achieve minimum layer counts between chip, package, and board. The end result is higher performance.