IMAPS Device Packaging 2019 – Fountain Hills, Arizona

When:
March 5, 2019 – March 6, 2019 all-day America/Detroit Timezone
2019-03-05T00:00:00-08:00
2019-03-07T00:00:00-08:00
Where:
WekoPa Resort
Fountain Hills
Arizona USA

The 15th International Conference and Exhibition on Device Packaging will be held March 4-7, 2019 at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona, USA.

The Device Packaging Conference is the largest 2019 conference dedicated to:

  • Interposers, 3D IC and Packaging
  • Fan-Out, Wafer Level Packaging and Flip Chip
  • Engineered Micro Systems/Devices (including MEMS/Sensors, 3D Printing and more)

http://www.imaps.org/devicepackaging/

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