IMAPS Device Packaging 2019 – Fountain Hills, Arizona
The 15th International Conference and Exhibition on Device Packaging will be held March 4-7, 2019 at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona, USA.
The Device Packaging Conference is the largest 2019 conference dedicated to:
- Interposers, 3D IC and Packaging
- Fan-Out, Wafer Level Packaging and Flip Chip
- Engineered Micro Systems/Devices (including MEMS/Sensors, 3D Printing and more)