IWLPC 2019

SMTA & Chip Scale Review

IWLPC 2019

by SMTA & Chip Scale Review
517 people viewed this event.

October 22 – 24, 2019
DoubleTree by Hilton San Jose
San Jose, California, USA

SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry’s most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

View Full Technical Program

Interconnecting Wafer-Level Packaging, 3D Packaging, Advanced Manufacturing and Test, the International Wafer-Level Packaging Conference (IWLPC) is at the forefront of the packaging technology evolution.

The Wafer-Level Packaging (WLP) track features sessions on Advanced Wafer Level Packaging & Materials, Reliability and Metrology, Fan Out Wafer level Packaging (FO-WLP), and Advanced Processing.

The 3D Packaging track features sessions on Design, Characterization and Test, Wafer Bonding and Chip Stacking, and Processing for Fan-Out.

The Advanced Manufacturing track features sessions on Process Materials and Equipment.

View PDF program here!



To register for this event please visit the following URL: https://www.iwlpc.com/register_now.cfm →


Date And Time



DoubleTree by Hilton San Jose San Jose, California, USA, San Jose, CA


DoubleTree by Hilton San Jose

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