PCB West 2017
Since 1991, PCB WestPCB West has been the place designers, fabricators and assemblers have gathered to exchange ideas and learn better ways to make printed circuit boards. Join the nearly 2,000 other industry professionals in Santa Clara, CA on September 12 – 14, 2017 for the highly acclaimed PCB West, the Silicon Valley’s largest event for the PCB industry.
Featuring a one-day exhibition and three-day technical conference, PCB West brings together the entire PCB industry to take advantage of unique opportunities to improve skills, increase knowledge and network with peers, colleagues and experts.
Zuken at PCB West 2017
Power Integrity and Decoupling Primer for PCB Designers
Ralf Bruening, Zuken
Today, supply voltages decrease with every new silicon generation, contributing to the goal of reducing power consumption of electronics. This and the resulting shrinking noise margins for these ICs define increasing demands for the quality and stability of power distribution systems of PCBs. Hence, tighter requirements and constraints from silicon vendors are defined for the power distribution networks (PDN) PCB designers have to follow – in conjunction with tighter decoupling schemes. Board real estate limitations, application-dependent restrictions (e.g. discrete package allowance in automotive) and cost demands further complicate the game.Read more
Improve Flexible Printed Circuit Manufacturing Productivity with Better DfM Checks
Steve Watt, Zuken USA
Flexible printed circuits (FPC) are not new. Yet, FPC is a growing segment and presents some new design and manufacturing challenges. For example, FPCs require new and different manufacturing checks compared to a traditional rigid PCB. These new DfM checks can improve design quality and manufacturing yields. This session will cover the FPC design process and the manufacturing checks that can improve your design and its manufacturability.
EDA Support and Roadmap for 3D Printing of PCBs
Humair Mandavia, Zuken USA
The rapid evolution and widespread use of 3D printing technology brings with it new approaches to the market for electronics design and manufacturing. At the same time, the increase of new applications with molded interconnect devices (MID) and inkjet printing has spurred the growth and adoption of additive manufacturing. This presentation will cover the convergence of these technologies for 3D printing of printed circuit boards, along with some of the key challenges and opportunities in this space. Printing of electronics is unique from other applications, so we will explore how to leverage new technology to support it, along with some of the other capabilities and content that will be required as part of the EDA roadmap.