SiP 2017

Inaugural Conference and Exhibition on System in Package (SiP) Technology

When:
June 27, 2017 – June 29, 2017 all-day
2017-06-27T00:00:00+00:00
2017-06-30T00:00:00+00:00
Where:
Doubletree Sonoma Wine Country
1 Doubletree
Rohnert Park, CA 94928
USA

IMAPS logoSiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, and new technology innovation enablers to meet current and future SiP challenges. This conference will bring the entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together under one roof.

Speakers, sponsors, exhibitors and attendees will focus on the insights of SiP technology in the relaxing Sonoma wine country of California, away from big city distractions.

Featuring three full days of technical sessions, panel discussions, exhibitors and local activities, SiP 2017 will provide dynamic learning and technology updates for SiP related trends and new engineering innovations from the industry’s world SiP leaders.

Zuken at SiP 2017

Enabling faster design and performance decisions for System in Package Architecture

TV Narayanan
Solutions Architect
Zuken USA

TV NarayananSmaller footprints along with higher bandwidth needs and tightening power performance requirements are forcing the move towards System in Package architectures in the automotive, IoT, and other leading markets. This is compounded by the fast pace of development that we are experiencing in other markets, such as mobile and internet-of-things (IoT) market segments. During the design process, engineers have to access many design and analysis tools, but most of the design flow is often unconnected and design data is exchanged manually. To meet aggressive schedule and market requirements, we aim to showcase a flow to tackle the problem with a native 3D hierarchical design approach incorporating IC-package co-design. Finally, we illustrate the benefits of using such an approach for solving the all-critical thermal “hotspot” issue, facilitating a quick turnaround for design/performance decisions