Upcoming Events

Inaugural Conference and Exhibition on System in Package (SiP) Technology @ Doubletree Sonoma Wine Country
Jun 27 – Jun 29 all-day

IMAPS logoSiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, and new technology innovation enablers to meet current and future SiP challenges. This conference will bring the entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together under one roof.

Speakers, sponsors, exhibitors and attendees will focus on the insights of SiP technology in the relaxing Sonoma wine country of California, away from big city distractions.

Featuring three full days of technical sessions, panel discussions, exhibitors and local activities, SiP 2017 will provide dynamic learning and technology updates for SiP related trends and new engineering innovations from the industry’s world SiP leaders.

Zuken at SiP 2017

Enabling faster design and performance decisions for System in Package Architecture

TV Narayanan
Solutions Architect
Zuken USA

TV NarayananSmaller footprints along with higher bandwidth needs and tightening power performance requirements are forcing the move towards System in Package architectures in the automotive, IoT, and other leading markets. This is compounded by the fast pace of development that we are experiencing in other markets, such as mobile and internet-of-things (IoT) market segments. During the design process, engineers have to access many design and analysis tools, but most of the design flow is often unconnected and design data is exchanged manually. To meet aggressive schedule and market requirements, we aim to showcase a flow to tackle the problem with a native 3D hierarchical design approach incorporating IC-package co-design. Finally, we illustrate the benefits of using such an approach for solving the all-critical thermal “hotspot” issue, facilitating a quick turnaround for design/performance decisions

PCB West 2017 @ Santa Clara Convention Center
Sep 12 – Sep 14 all-day

PCB West 2017 logoSince 1991, PCB WestPCB West has been the place designers, fabricators and assemblers have gathered to exchange ideas and learn better ways to make printed circuit boards. Join the nearly 2,000 other industry professionals in Santa Clara, CA on September 12 – 14, 2017 for the highly acclaimed PCB West, the Silicon Valley’s largest event for the PCB industry.

Featuring a one-day exhibition and three-day technical conference, PCB West brings together the entire PCB industry to take advantage of unique opportunities to improve skills, increase knowledge and network with peers, colleagues and experts.

Zuken at PCB West 2017

Power Integrity and Decoupling Primer for PCB Designers

Ralf Bruening, Zuken

Ralf Bruening, ZukenToday, supply voltages decrease with every new silicon generation, contributing to the goal of reducing power consumption of electronics. This and the resulting shrinking noise margins for these ICs define increasing demands for the quality and stability of power distribution systems of PCBs. Hence, tighter requirements and constraints from silicon vendors are defined for the power distribution networks (PDN) PCB designers have to follow – in conjunction with tighter decoupling schemes. Board real estate limitations, application-dependent restrictions (e.g. discrete package allowance in automotive) and cost demands further complicate the game.

In this two-hour workshop, the requirements and basics of PCB power distribution systems are explained in detail. Issues like plate capacitance, loop inductances and cavity resonance are explained without deep math. Side effects to the signal integrity and EMC behavior of board structures are discussed using illustrated practical examples. The role of decoupling capacitors and their evolution in recent years is a major part of the workshop. Guidelines for a first order covering and resolving power integrity issues are given, regardless of the PCB design and ECAD process used. Simulation capabilities addressing power-integrity during PCB design will be explained and demonstrated by slides in a generic vendor-neutral manner as a problem=solving approach. Silicon vendor support documents (e.g., constraint and spreadsheet tools) to address power integrity are introduced and discussed. Examples from various industries (e.g., automotive) will complement the session with practical application experience.

Improve Flexible Printed Circuit Manufacturing Productivity with Better DfM Checks

Steve Watt, Zuken USA

Steve Watt, ZukenFlexible printed circuits (FPC) are not new. Yet, FPC is a growing segment and presents some new design and manufacturing challenges. For example, FPCs require new and different manufacturing checks compared to a traditional rigid PCB. These new DfM checks can improve design quality and manufacturing yields. This session will cover the FPC design process and the manufacturing checks that can improve your design and its manufacturability.

EDA Support and Roadmap for 3D Printing of PCBs

Humair Mandavia, Zuken USA

Humair MandaviaThe rapid evolution and widespread use of 3D printing technology brings with it new approaches to the market for electronics design and manufacturing. At the same time, the increase of new applications with molded interconnect devices (MID) and inkjet printing has spurred the growth and adoption of additive manufacturing. This presentation will cover the convergence of these technologies for 3D printing of printed circuit boards, along with some of the key challenges and opportunities in this space. Printing of electronics is unique from other applications, so we will explore how to leverage new technology to support it, along with some of the other capabilities and content that will be required as part of the EDA roadmap.


POWER-GEN International 2017 @ Las Vegas Convention Center
Dec 5 – Dec 7 all-day

POWER-GEN InternationalAs the world’s largest power generation event, POWER-GEN International is the industry leader in providing comprehensive coverage of the trends, technologies and issues facing the generation sector. More than 1,400 companies from all sectors of the industry exhibit each year to benefit from the exposure to more than 20,000 attendees. Displaying a wide variety of products and services, POWER-GEN International represents a horizontal look at the industry with key emphasis on new solutions and innovations for the future.

Benefits of Attending

  • See the latest technologies, innovations and trends from over 1,400 exhibitors
  • Learn how to successfully implement these innovations into your operations to cut costs, maximize efficiencies, improve visibility, and reduce risk
  • Network with thousands of other industry professionals
  • Get insight into practical solutions to complex problems, including valuable skills that will better equip you to do your job better
  • Hear from powerful speakers with innovative ways to tackle the latest industry challenges
  • Investigate real-world case studies
Zuken Innovation World 2018 @ Coronado Island Marriott Resort & Spa
Apr 23 – Apr 25 all-day

Join Zuken in San Diego

ZIW logoZuken Innovation World is the Zuken series of annual conferences that takes place at different venues around the globe. The conferences bring together our customers, interested parties and other industry professionals for networking, learning and sharing of innovative ideas.

Each event is structured around the common theme of innovation and is organized with the specific needs of the local Zuken communities in mind.