This webinar will detail the process of creating wire harness quotations and the design detail required for the test and manufacturing of simple and complex harnesses. A large component database with links to manufacturing aids and tools is key to accurate quotation and design output.Register Now
Featuring a one-day exhibition and three-day technical conference, PCB West brings together the entire PCB industry to take advantage of unique opportunities to improve skills, increase knowledge and network with peers, colleagues and experts.
Zuken at PCB West 2017
Nano Dimension, a leader in PCB 3D printing technology will be in the Zuken booth. Please stop by and learn more about PCB 3D printing technology.
Power Integrity and Decoupling Primer for PCB Designers
Ralf Bruening, Zuken
Today, supply voltages decrease with every new silicon generation, contributing to the goal of reducing power consumption of electronics. This and the resulting shrinking noise margins for these ICs define increasing demands for the quality and stability of power distribution systems of PCBs. Hence, tighter requirements and constraints from silicon vendors are defined for the power distribution networks (PDN) PCB designers have to follow – in conjunction with tighter decoupling schemes. Board real estate limitations, application-dependent restrictions (e.g. discrete package allowance in automotive) and cost demands further complicate the game.
Improve Flexible Printed Circuit Manufacturing Productivity with Better DfM Checks
Steve Watt, Zuken USA
Flexible printed circuits (FPC) are not new. Yet, FPC is a growing segment and presents some new design and manufacturing challenges. For example, FPCs require new and different manufacturing checks compared to a traditional rigid PCB. These new DfM checks can improve design quality and manufacturing yields. This session will cover the FPC design process and the manufacturing checks that can improve your design and its manufacturability.
EDA Support and Roadmap for 3D Printing of PCBs
Humair Mandavia, Zuken USA
The rapid evolution and widespread use of 3D printing technology brings with it new approaches to the market for electronics design and manufacturing. At the same time, the increase of new applications with molded interconnect devices (MID) and inkjet printing has spurred the growth and adoption of additive manufacturing. This presentation will cover the convergence of these technologies for 3D printing of printed circuit boards, along with some of the key challenges and opportunities in this space. Printing of electronics is unique from other applications, so we will explore how to leverage new technology to support it, along with some of the other capabilities and content that will be required as part of the EDA roadmap.
This webinar will examine the challenges behind design data security and explore some of the solutions available today. Some of the topics will include a project oriented design approach, limited user visibility on the library and design level and how to physically locate IP.Register Now
This webinar will outline the best practices for creating harness manufacturing drawings. The overall cost of designing and manufacturing a harness can be drastically reduced by following a few simple steps. These cost reducing best practices are applicable to both in-house and outsourcing manufacturing.Register Now
IWLPC brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies.
Addressing wafer-level packaging, 3D, and Advanced Manufacturing & Test technologies, the International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution. The conference has a rich history of bringing together attendees from over 16 countries in the heart of Silicon Valley to immerse themselves in the latest technology and business trends. Going into its 14th year, the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry, and SMTA, the distinguished global association representing electronic assembly and manufacturing professionals.
The conference comprises three parallel technical tracks with two full days of presentations on wafer-level packaging, 3D integration, and Advanced Manufacturing & Test. Workshops, keynote speakers, and panel discussions are offered by world-class experts and enable attendees to broaden their technical knowledge. The technical program includes a two-day expo where 60+ exhibitors showcase their latest technologies and products. The conference provides a collective network of over 800 industry professionals, including vendors from leading semiconductor companies, foundries, and OSATs, as well as key technology, equipment, and materials suppliers in the exhibit area. Attendees will be inspired by the quantity and quality of the featured new developments and emerging technologies.
Zuken at IWLPC 2017
Zuken will have a tabletop exhibit at IWLPC 2017. The conference will also feature our presentation, New CAD Tools Feature for Virtual Prototyping.
The 2017 release of E3.series is leading the way in helping companies manage, design and develop products of tomorrow. Design spaces such as panels, harnesses, PLCs, fluid controls and much more are all part of the evolution to make it easier and faster to get your products to market.
The goal of this webinar is to give you a brief look into Zuken’s newest E3.series release. E3.series is a Windows-based, scalable, easy-to-learn system for the design of wiring and control systems, hydraulics and pneumatics. The latest release contains new and enhanced functionality that further increases productivity throughout all phases of engineering, from design to manufacture.
We will demonstrate workflows that help designers take the next leap in productivity in various industries like aerospace, harness manufacturing, industrial machinery etc. The attendees will have a chance to ask questions and learn about the latest developments towards fully automating your design workflow.Register Now
As the world’s largest power generation event, POWER-GEN International is the industry leader in providing comprehensive coverage of the trends, technologies and issues facing the generation sector. More than 1,400 companies from all sectors of the industry exhibit each year to benefit from the exposure to more than 20,000 attendees. Displaying a wide variety of products and services, POWER-GEN International represents a horizontal look at the industry with key emphasis on new solutions and innovations for the future.
Benefits of Attending
- See the latest technologies, innovations and trends from over 1,400 exhibitors
- Learn how to successfully implement these innovations into your operations to cut costs, maximize efficiencies, improve visibility, and reduce risk
- Network with thousands of other industry professionals
- Get insight into practical solutions to complex problems, including valuable skills that will better equip you to do your job better
- Hear from powerful speakers with innovative ways to tackle the latest industry challenges
- Investigate real-world case studies
Join Zuken in San Diego
Zuken Innovation World is the Zuken series of annual conferences that takes place at different venues around the globe. The conferences bring together our customers, interested parties and other industry professionals for networking, learning and sharing of innovative ideas.
Each event is structured around the common theme of innovation and is organized with the specific needs of the local Zuken communities in mind.