IWLPC brings together some of the semiconductor industry’s most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.
This webinar will discuss how a component data management system together with a trusted content provider, such as SiliconExpert, provides the backbone for making your design environment an accurate and robust source for engineering component selection.
Electrical and mechanical collaboration has been discussed and desired for many years without a clear solution. The best workflow and process is still elusive to many design teams. The advantage of working with multiple teams using various domain tools has given our experts a unique perspective on the solution with the best probability of success.
The typical first step has been to use a common platform for electrical and mechanical design. This approach has proven to be a futile gamble in most cases. The gains from the collaboration are almost always wiped out by use of un-optimized tools for the electrical design.
The best approach we have found working with various partners is to ensure the use of best in class tools immaterial of discipline, while ensuring the tools have cross-platform collaboration capabilities. Intelligent and purpose built electrical design tools like Zuken E3.series help you maximize the design quality and collaborate with most mechanical design systems.
There is one thing that all design engineers will agree on. Creating and gathering all the required data for a release to the PLM system is error-prone and can be a “messy”. We all understand the value of releasing our design data to the corporate PLM system, but a best practice design process dictates multiple release profiles with different purposes and different data requirements. Checkpoints and design reviews may require schematic and board viewables, a current BOM, specifications, simulation results and supporting documents. Prototype, First Article and Full Production builds have different release package content requirements. And let’s not forget about the ECO process and its data needs.
This webinar will discuss the different release profiles from WIP to a manufacturing-centric PLM system followed by the demonstration of best practices that can make the job easier and more reliable.
DS-CR, Zuken’s Design Data Management System, offers a reliable and controlled release of your WIP engineering data to PDM/Manufacturing.
This webinar will explore the benefits of a modern PCB panelization process that can lower manufacturing costs and give your control of the DFM process as soon as the actual board outline is determined. Learn how you can start with a PCB design that is still in the layout phase and instantiate it into a panel. We will explain what items are part of the PCB design and what items should be designed into the panel such as routing and v-cut details.
Last year, DistribuTECH culminated with 13,500+ Individuals from 77 Countries, including qualified professionals from 326 Electric, Gas and Water Utilities. In short, utilities depend on DistribuTECH to learn, network and conduct business.
A drawing on paper remains 2 dimensional with little to no room for improvement multi-dimensional content. A PDF is a step up with the ability to pack a few layers of data but without the ability to have detailed instructions to drive manufacturing excellence.
E3.series Wiring Checks works with your robust design data to create a step by step wiring and review system to accelerate deployment and manufacturing velocity. The system provides an efficient method to track, report and instruct a robust process to drive your amazing designs towards an amazing product.
Zuken Innovation World is our series of annual conferences taking place around the globe. The conferences bring together our customers, partners and industry professionals for networking, learning and sharing of innovative ideas.
Each event is structured around the common theme of innovation and is organized with the specific needs of the local Zuken communities in mind.
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.