The 15th International Conference and Exhibition on Device Packaging will be held March 4-7, 2019 at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona, USA.
The Device Packaging Conference is the largest 2019 conference dedicated to:
- Interposers, 3D IC and Packaging
- Fan-Out, Wafer Level Packaging and Flip Chip
- Engineered Micro Systems/Devices (including MEMS/Sensors, 3D Printing and more)
Zuken Innovation World is our series of annual conferences taking place around the globe. The conferences bring together our customers, partners and industry professionals for networking, learning and sharing of innovative ideas.
Each event is structured around the common theme of innovation and is organized with the specific needs of the local Zuken communities in mind.
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.