Upcoming Events

ECTC 2019 – Las Vegas, Nevada
May 25 – Jun 2 all-day

ECTC logoThe Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

ANSYS Innovation Conference – Southern California
May 30 @ 12:00 pm – 8:00 pm

Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.

Join us in Irvine, CA for the annual ANSYS Innovation Conference on May 30, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.

This event is FREE to attend, register early to reserve your spot. Lunch will be provided.  Complimentary parking is available.


Title: “Package Development of Large Scale SoCs Using CR-8000 Design Force and Ansys”

Speaker: Motochika Okano, Chief Specialist, Package Solution Technology Development Dept., Toshiba

Summary: Traditional design processes constrain the ability to conduct feasibility studies on identifying optimal package architectures from a system-level perspective. Feedback from these studies is manually communicated for production design, leading to an inefficient process and creates difficulty in correlating analysis data. This presentation will explain how collaboration with Ansys and Zuken enables new design and analysis flow that streamlines the feasibility phase and driving the intelligent process to production design to help release an implementation of current and future package architectures.


Title: “Enabling Early and Fast Thermal Simulation for 3D Multi-Die System Designs”

Speaker: Lance Wang

Summary: As design complexity increases with 3DICs  and time-to-market becomes a critical component in the automotive, wearables and IoT segments, reducing design cycle time while maintaining the accuracy of analysis has become all the more important. To address this, a system level co-design approach in step with multi-physics analysis is presented. To mitigate errors due to the manual exchange of data between various engineering teams spread across chip, package, and board with design and analysis adding a further level of exchange, a design flow incorporating simplification at the layout level is shown. The flow enables various levels of simplified models to be used, wherein data transfer between the complex 3D structures in layout to the thermal analysis tool is automated. The efficacy of the model simplification is verified through a test case showing comparable results for the simplified and full models.

PCB West 2019
Sep 9 – Sep 12 all-day

The Largest Conference and Exhibition for Printed Circuit Board Design, Fabrication, and Assembly in the Silicon Valley

For 28 years PCB West has trained designers, engineers, fabricators and, lately, assemblers on making printed circuit boards for every product or use imaginable. The September 2018 event attracted nearly 2,000 designers and engineers and more than 100 exhibitors for the three-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace to cutting-edge IoT and wearables, there’s something for everyone involved in the electronics supply chain. This is one show you cannot afford to miss.

We will be exhibiting Tuesday, September 10 and our booth number is 500.