E3.GENESYS Connector bridges product model and detailed design

Zuken USA, Inc., and Vitech, a Zuken Company, announced the industry’s first model-based wire harness design process as part of its digital engineering initiative. The new process fills the design gap that previously required the manual translation of the product model into schematics and spreadsheets to begin implementation. This manual effort can take weeks and breaks any direct connection between the model and the development process, making the ROI of a model-based design process almost impossible to measure. Zuken’s new E3.GENESYS Connector directly connects the product model to the wire harness design process, saving significant time and maximizing ROI.

Taking a digital engineering approach to manufacturing—one composed of architecture-driven and model-based engineering—offers significant advantages (not to mention tangible benefits both in terms of time and costs). Yet, change is never easy. How can engineering executives ease the transformation? This Survival Guide to Digital Engineering will help create a path to success.

Electromagnetic compatibility (EMC) problems are often responsible for re-design cycles during the PCB design process. Due to ever shorter innovation cycles of electronic products like cell phones, or IoT applications such as fitness trackers or smartwatches, it is essential to avoid these time-consuming re-design cycles under all circumstances. In this post, I’ll walk you through the essentials of EMC for PCB Design. Once you understand the basics, you’ll see there’s nothing mystical about it.