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Zuken Innovation World Americas 2019
That’s a Wrap!
Back in a January post, I listed some of the top reasons to attend Zuken Innovation World Americas 2019. Now that the conference is over and we’re taking a closer look, I’m pleased to say that we didn’t miss a beat. Here are some of the highlights from the event along with first-hand participant feedback.
Don’t miss the ZIW pictures and video >>
PCB West 2019
September 9-12th, 2019 Santa Clara, CA
For 28 years PCB West has trained designers, engineers, fabricators and, lately, assemblers on making printed circuit boards for every product or use imaginable. The September 2018 event attracted nearly 2,000 designers and engineers and more than 100 exhibitors for the three-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace to cutting-edge IoT and wearables, there’s something for everyone involved in the electronics supply chain.

Stop by booth #500 to see the latest Zuken products.

Learn More >>
Partner News
E3.series Component Database - TE Connectivity HDC Series 2019
Libraries are an integral part of the underlying intelligent design methodologies in Zuken E3.series design suite. TE Connectivity Ltd and Zuken have been working together in various capacities to enable users to access the latest products easily.

As part of the library effort, we are pleased to offer the HDC series library from TE Connectivity. The library contains 1600 parts comprised of connectors, pin terminals, housing, and other miscellaneous items. 
Visit the Zuken USA Community to access the library >>
Our Community Has The Best
Tool Tips
CR-8000 Design Force View Settings for Each Object on the Canvas
View settings can now be changed for each object on the canvas in Design Force 2018. View settings tailored to each object helps improve the visibility of the board design. The view settings are switched on the layer view panel. The settings can be configured for "On board" and "In component" separately. Individual objects that can be turned on/off are determined by layer type.

Display the Preview Symbol for Your Selected Components
In E3.series 2018, new features were added to allow the user to display their Preview symbol in the Preview windows for their selected component. First, the user can select a symbol used by a device in the project and that Preview symbol for that component will be displayed in the Preview window. Second, under Device Properties, when the user changes a component code, the new component that is selected will display its preview symbol in the Preview Window.

Join Our Community To See All The Latest Tips & Tricks
White Paper
Electrical Engineering Data Management
A Practical Foundation for a True Mechatronic Data Model
The growing importance of electrics and electronics in modern products, machines, and systems calls for an interdisciplinary collaboration during the early phases of the product development process (PDP), which is frequently referred to as “mechatronic engineering.” In this context, established methods, such as managing mechanical, electrical and software development data in separate environments are reaching their limitations.

Must Read Articles From
Our Blog
Shorter Design Cycles with Better ECAD-MCAD Collaboration
By Ed Duranty
Every day, more and more of our lives become connected with IoT technology. With billions of smart products already out there, the demand for this technology shows no signs of slowing down anytime soon. Even with increasing demand, executives are asking engineers to develop products on shorter and shorter design cycles. One area for improvement is a collaboration between electrical and mechanical engineers during the board development process.

Read More Blog Articles Here >
Zuken joins the UCLA CHIPS consortium
Zuken has joined the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS), a collaborative academic / industry research endeavor, to develop solutions to address the challenges associated with the growing demand for computing power in heterogeneous computing environments.

UCLA CHIPS consortium consists of industrial partners from material suppliers, equipment manufacturers, foundries to system integrators, and includes support from universities and government agencies and industrial consortia, working collaboratively to develop new packaging technologies and system architectures and develop the next generation workforce.


Test Drive E3.series and CR-8000

E3.series: Electrical and Wire Harness Design
CR-8000: Advanced PCB Design
Harness Builder for E3.series
E3.series is a Windows-based, scalable, easy-to-learn system for the design of wiring and control systems, hydraulics and pneumatics.
CR-8000 is a product-centric design solution that provides the tools to optimize a design at both the product and PCB design level.
Harness Builder for E3.series is a powerful yet easy to use tool based on the proven E3.series toolset from Zuken.

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