Electronic Specifier: Power Integrity Module is a Star Turn
April 11, 2017
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- 1.34 MB File Size
- 1 File Count
- April 11, 2017 Create Date
- November 22, 2017 Last Updated
TEWS reduced development time and cost of complex high-speed PCBs using concurrent power integrity simulation. Michael Költzow, TEWS Technologies explains how it was done.
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| File | Action |
|---|---|
| AR-TEWS CADSTAR-Electronic Specifier Power-April2014.pdf | Download |