Toshiba achieved significant product size reduction using 3D chip, package, board co-design in CR-8000 Design Force
January 24, 2018
- Version
- 92 Download
- 1.08 MB File Size
- 1 File Count
- January 24, 2018 Create Date
- September 19, 2018 Last Updated
- Download
Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm.
File | Action |
---|---|
CS-CR-Toshiba-EN.pdf | Download |