Toshiba achieved significant product size reduction using 3D chip, package, board co-design in CR-8000 Design Force
January 24, 2018
Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm....
Toshiba Case Study Slides
January 23, 2018
These slides are an abridgment of two presentations given by Toshiba at the Zuken Innovation World (ZIW) conference held in Japan in 2012 and 2013. ...