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Zuken Innovation World 2020 Cancelled
After thoughtful consideration, Zuken USA, Inc. has made the decision to cancel Zuken Innovation World Americas 2020. The safety and health of our staff and attendees is our number one priority. We are adhering to the guidance provided by the US Centers for Disease Control and Prevention and the orders and regulations in the County of San Diego to contain the spread of the COVID-19 virus in the United States.
Though we won’t see you in person, in the spirit of ZIW, we want to keep you informed and to provide you with ongoing learning opportunities. In late April we’re making portions of the conference content available to you via online webinars, so watch your email for details.
ZIW will be back in 2021 in Scottsdale, Arizona, June 7-10 and we look forward to seeing you there!
Developing Our Next-Generation SE Workforce
By: David Long
Whenever I visit an organization engaged in systems engineering, the #1 challenge is always the same. Large or small, seasoned or new, government or commercial, the complaint is always the shortage of good systems engineers. The common refrain is “we don’t have enough, and many of the ones we have are retiring.” As organizations embrace model-based systems engineering, the problem worsens with a limited pool of model-based talent in high demand around the globe.

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Be First to Market with DDR5! Here’s How…
DDR5 is the latest generation of memory in development, doubling the peak data rate to 6400 MT/s (compared to DDR4). With great technical ambitions come much tighter specifications for system PCB designers; Especially when faced with channel loss, skew, reflections and crosstalk, all of which become much more significant at higher frequencies. In fact, PCB design margins are so minimal that DDR5 introduces equalization on the commodity DRAM chips, for the first time...

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Methods for Modeling Backshells, Part 1
Backshells are commonly used to augment the connector assembly in cable harnesses and can be represented in multiple ways in E3.series. This video covers the first 2 of 4 different methods of representing backshells in E3.series.

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Multi-Board Signal Integrity
The first step to checking signal integrity between 2 boards is to create a system connection using the Multi-Board CB. Select the Multi-Board tab in Design Force, then Multi-Board CB. Start a new configuration file and select the 2 boards and open them...

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Topology Planning and Hierarchical Design
By: Taras Wallace
Early stages of complex designs often lack the specific details required to create a detailed design. Therefore, topology planning is an important part of managing the placement of systems and sub-systems. The hierarchical design is a top-down design approach to communicate the details of a complex system. It is easy to use the terms ‘Hierarchical Design’ and ‘Topology Planning’ incorrectly and interchangeably. On one hand, the system location is the primary driver of a topological arrangement. On the other hand, logical and functional order is the primary driver of the hierarchical design.

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Why Use Automated ECAD Tools to Quote Wire Harnesses?
Does generating a quote for manufacturing a harness seem complicated and cumbersome?

You are not alone. It is a common theme across many industries. Precious resources are spent keeping track of parts, long lead items, cost of parts vs. labor, etc. and invariably a manual process leads to gaps and errors. Delayed projects and cost penalties are hurting bottom lines across the board.

EWPTE 2020– The Largest Dedicated Wire Processing Event Of The Year

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E3.series: Electrical and Wire Harness Design
Harness Builder for E3.series
E3.series is a Windows-based, scalable, easy-to-learn system for the design of wiring and control systems, hydraulics and pneumatics.
Harness Builder for E3.series is a powerful yet easy to use tool based on the proven E3.series toolset from Zuken.

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